Optimize your gaming rig's performance with this high-efficiency thermal paste, featuring a thermal conductivity of 12.50 W/mK for exceptional heat transfer. Designed to withstand temperatures up to 350°C, this heat sink compound ensures maximum cooling efficiency with a density of 3.70 g/cm³. The compact 0.27 ml syringe provides precise application with minimal waste, making it ideal for enhancing the thermal management of CPUs and GPUs. Lightweight at just 1 g, it's a small but crucial component for any high-performance setup.